Video Newscast - August 14, 2008
This week in Global SMT & Packaging video news:China shows its technical might at Olympic opening, Dover Corp. increases dividend by 25%, new rubber material conducts electricity, FocalSpot introduces a new desktop AOI system, Valor introduces the Innovation Circle, Cookson clarifies their European strategy, and SMTAI prepares for lift-off. Watch the news now.
Breaking News
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Wednesday, 27 August 2008 |
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Salary budgets for management positions increased 3.9%, while hourly positions increased 3.3%. Benefit costs in 2006 were, on average, 16.8% of total wages, down from 21.6% in 2004. |
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Wednesday, 27 August 2008 |
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At the Beijing Olympics, BiAmp’s audio processors are being used at the soccer and tennis venues, as well as the emergency control center and the national pressroom - all areas where quality is paramount. |
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Wednesday, 27 August 2008 |
E-Switch’s New Illuminated Tactile Switch has Multiple LED Options |
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Wednesday, 27 August 2008 |
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1st - 4th September 2008, Greenwich, London, U.K. |
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Wednesday, 27 August 2008 |
Koh Young’s winner was its new aSPIre next generation 3D In-line solder paste inspection system, offering true 100% 3D solder paste measurement based on a patented shadow-free measurement technology. |
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Tuesday, 26 August 2008 |
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Over 39 years experience in electronic packaging and interconnection technology, “Mr Reliability” is how Werner Engelmaier is known in the US! |
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Tuesday, 26 August 2008 |
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Agilent Technologies Presents Web Seminar on Logic Analyzer Basics |
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Tuesday, 26 August 2008 |
The compny has just introduced a new film that adds an antistatic protection without compromising any of the protection from particulates or chemical compounds that will be found in ordinary flexible packaging. |
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Tuesday, 26 August 2008 |
The resulting benefits include usage on temperature critical components, energy savings, no mixing and simplified automation. |
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Tuesday, 26 August 2008 |
These two standards are now operating as an integrated management system (IMS) in the Cookson Monterrey facility, and will soon be joined by the Occupational Health & Safety (OH&S) Standard OHSAS 18001:2007 in early 2009 or sooner. |
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Friday, 22 August 2008 |
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Module Provides Industry's Fastest Lock Time in a Protocol Analyzer to Support Active State Power Management Capture and Analysis for PCI Express 2.0(r) |
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Friday, 22 August 2008 |
The best of both worlds: an easy-to-use software tool with extraordinary test and programming capabilities |
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Friday, 22 August 2008 |
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The Semiconductor Applications Center represents a multi-million dollar investment that further enables Enthone to deliver customer-driven solutions to the dynamic wafer fabrication marketplace. |
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Friday, 22 August 2008 |
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Agilent is making these upgrades available through their normal support contracts or via one-time software updates for Agilent 3070 users. |
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Thursday, 21 August 2008 |
Software is PCI-SIG Approved for PCI Express 2.0 Compliance Testing |
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Thursday, 21 August 2008 |
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Valor Computerized Systems Ltd. [Prime Standard: VCR], a global provider of productivity improvement software solutions for the printed circuit board industry, announced today its financial results for the period ending June 30, 2008. |
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Thursday, 21 August 2008 |
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Accuracy is 40 microns at 3 sigma for the AX-501, and as good as 20 microns for complex, fine-pitch and odd-form components on the AX-201. |
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Thursday, 21 August 2008 |
The iineo platform features many improvements to the Europlacer machine range such as a higher feeder count, increased board size, 01005 placement process capability and increased maximum component height. |
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Thursday, 21 August 2008 |
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Designed for high-density flash, the Flashstream programs NAND and NOR Flash up to 32 Gb (gigabit) and has upgradeable RAM for future densities. |
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Wednesday, 20 August 2008 |
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Teknek, the global leader in contact cleaning equipment for the electronics sector, has appointed InterLatin as its distributor for Mexico. |
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Featured Interview
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ERSA has arguably the widest range of soldering, printing and inspection solutions in the industry. Andy Kellard visited the €70M German powerhouse to speak with COO Bernd Schenker.
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Lead-Free Matters
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Over the last few years I have been asked to examine many different ball grid array (BGA) defects from assembly and on field failures here are a selection of the defects and some of the popular causes.
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Global Business
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Component orders may be exceeding end market demand.
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