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Video Newscast - August 14, 2008

This week in Global SMT & Packaging video news:
China shows its technical might at Olympic opening, Dover Corp. increases dividend by 25%, new rubber material conducts electricity, FocalSpot introduces a new desktop AOI system, Valor introduces the Innovation Circle, Cookson clarifies their European strategy, and SMTAI prepares for lift-off. Watch the news now.
Breaking News
IPC Releases Salary Reports for PCB, EMS Industries
Wednesday, 27 August 2008
Salary budgets for management positions increased 3.9%, while hourly positions increased 3.3%. Benefit costs in 2006 were, on average, 16.8% of total wages, down from 21.6% in 2004.
 
Juki KE2070/KE2080 Placement Systems “Pump up the Volume” at Beijing Olympics
Wednesday, 27 August 2008

Juki KE2070At the Beijing Olympics, BiAmp’s audio processors are being used at the soccer and tennis venues, as well as the emergency control center and the national pressroom - all areas where quality is paramount.

 
E-Switch Announces New Illuminated Tactile Switch!
Wednesday, 27 August 2008
E-Switch TL1290 IlluminatedE-Switch’s New Illuminated Tactile Switch has Multiple LED Options
 
2nd Electronics System-Integration Technogloy Conference
Wednesday, 27 August 2008
1st - 4th September 2008, Greenwich, London, U.K.
 
Koh Young aSPIre 3D SPI Wins Coveted Global Technology Award
Wednesday, 27 August 2008
Koh Young’s winner was its new aSPIre next generation 3D In-line solder paste inspection system, offering true 100% 3D solder paste measurement based on a patented shadow-free measurement technology.
 
“Mr Reliability” kicks off European reliability summit
Tuesday, 26 August 2008
Over 39 years experience in electronic packaging and interconnection technology, “Mr Reliability” is how Werner Engelmaier is known in the US!
 
Web Seminar on Logic Analyzer Basics On September 23, 2008
Tuesday, 26 August 2008
Agilent Technologies Presents Web Seminar on Logic Analyzer Basics
 
ZEAL Clean Supplies introduces permanent, clean antistatic polythene packaging
Tuesday, 26 August 2008
The compny has just introduced a new film that adds an antistatic protection without compromising any of the protection from particulates or chemical compounds that will be found in ordinary flexible packaging.
 
Sealing & Potting your electronics with ThreeBond – A New Approach
Tuesday, 26 August 2008
Threebond 1661The resulting benefits include usage on temperature critical components, energy savings, no mixing and simplified automation.
 
Cookson Electronics Achieves ISO Certifications at Mexico Plant
Tuesday, 26 August 2008
These two standards are now operating as an integrated management system (IMS) in the Cookson Monterrey facility, and will soon be joined by the Occupational Health & Safety (OH&S) Standard OHSAS 18001:2007 in early 2009 or sooner.
 
E2960B for PCI ExpressR Protocol Test Now Includes Module for Active State Power Management Testing
Friday, 22 August 2008
Module Provides Industry's Fastest Lock Time in a Protocol Analyzer to Support Active State Power Management Capture and Analysis for PCI Express 2.0(r)
 
JTAG Technologies' ProVision raises the boundary-scan bar
Friday, 22 August 2008
Application Executive adds automated JTAG test sequencing to ProVision v1.5The best of both worlds: an easy-to-use software tool with extraordinary test and programming capabilities
 
Enthone Opens Semiconductor Applications Center in Taiwan
Friday, 22 August 2008

Stream Chung, PhD, Senior Application Manager, adjusts the laser profiler which is housed at the Enthone Semiconductor Applications Center in Taiwan.  The advanced instrumentation provides a nondestructive method for deposit topography and is extremely useful in determining plating bump height uniformity and roughness in wafer plating.The Semiconductor Applications Center represents a multi-million dollar investment that further enables Enthone to deliver customer-driven solutions to the dynamic wafer fabrication marketplace.

 
New Life for Existing Test Equipment
Friday, 22 August 2008

Agilent is making these upgrades available through their normal support contracts or via one-time software updates for Agilent 3070 users.

 
Agilent Technologies Introduces Free Phase-Locked Loop Analysis Software
Thursday, 21 August 2008
86100CU-Option 400 for the 86100C Infiniium digital communication analyzer (DCA-J) is an advanced software application that makes fast, accurate and repeatable phase-locked loop (PLL) measurements, also called jitter transfer measurements, using a precision jitter source and receiver.Software is PCI-SIG Approved for PCI Express 2.0 Compliance Testing
 
Valor Announces H1/2008 and Q2/2008 Results
Thursday, 21 August 2008

Valor Computerized Systems Ltd. [Prime Standard: VCR], a global provider of productivity improvement software solutions for the printed circuit board industry, announced today its financial results for the period ending June 30, 2008.

 
ASSEMBLÉON SHOWS A-SERIES PICK & PLACE AT NEPCON SHENZHEN
Thursday, 21 August 2008

Assembléon AX501-RL-054497 with trayAccuracy is 40 microns at 3 sigma for the AX-501, and as good as 20 microns for complex, fine-pitch and odd-form components on the AX-201.

 
Europlacer Wins a 2008 Global Technology Award for Its Innovative iineo Platform
Thursday, 21 August 2008
The iineo platform features many improvements to the Europlacer machine range such as a higher feeder count, increased board size, 01005 placement process capability and increased maximum component height.
 
BPM’s Flashstream Flash Vector Programming System Wins a 2008 Global Technology Award
Thursday, 21 August 2008

Designed for high-density flash, the Flashstream programs NAND and NOR Flash up to 32 Gb (gigabit) and has upgradeable RAM for future densities.

 
Teknek appointed InterLatin as its distributor for Mexico
Wednesday, 20 August 2008
Teknek, the global leader in contact cleaning equipment for the electronics sector, has appointed InterLatin as its distributor for Mexico.
 
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Featured Interview

Interview: Bernd Schenker, ERSA

ERSA has arguably the widest range of soldering, printing and inspection solutions in the industry. Andy Kellard visited the €70M German powerhouse to speak with COO Bernd Schenker.
COO of ERSA, Bernd Schenker

 

Lead-Free Matters

Ball grid array & lead-free assembly defects, part 2

Over the last few years I have been asked to examine many different ball grid array (BGA) defects from assembly and on field failures here are a selection of the defects and some of the popular causes.
Bob Willis

 

Global Business

Challenging times ahead...

Component orders may be exceeding end market demand.

 

 

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